USMGO 便携式超声波探伤仪

描述

USMGO 便携式超声波探伤仪

尺寸小巧，功能强大
介绍将实地无损检测提升至全新水平的 USM Go+。 轻巧方便，通过直观的方向键盘进行操控，外壳下方安装了先进的工业电子器件，可以实现出色的超声波性能，能够可靠地识别测试件的近表面缺陷。

优势
便携式超声波检测的理想设备，由于其使用便利性，十分适合用于密闭空间。
USM Go+ 采用坚固的橡胶外壳设计，可以承受极其恶劣的现场条件，并且符合 IP67 防尘防水标准。
108mm x 64,8 mm 的屏幕（放大模式）具有出色的 800 x 480 像素分辨率，可提供一流的回波分辨力
无论是在明亮的日光下还是在黑暗中，显示屏均可清晰读取，并且可以根据您的作业环境进行调节。
出色的近表面分辨率使您能够非常可靠地检测试件表面下的缺陷

特点
A-Scan 视频记录长达 8 分钟，可以现场报告和回放整个检测过程，供更多人员查看
一款真正的双手通用仪器，其显示屏具有翻转功能
AUTOANG（自动角度测量）功能可以自动计算斜探头横波折射角，并利用它测量缺陷水平距离和深度距离
标准的 USB 连接允许从探伤仪下载数据，以便进一步分析或储存
仪器的 2GB 内存可轻松替换至高达 16 GB 的 SD 卡
生成的报告为 jpeg 或 bmp 格式，因此不需要特殊的阅读软件
底波衰减器（BEA）有助于发现极为细微的缺陷，提高探测能力
2 个栅极的自动栅极阈值可确保在相同条件下进行准确测量

应用
焊缝检测
锻件和铸件检测
轨道检测
复合材料检测
要求更高的应用，如窄带滤波器、低噪声数字放大器和方波脉冲发生器

USMGO

USMGO 便携式超声波探伤仪

Small size, powerful
Introducing USM Go+, which takes field nondestructive testing to a whole new level. Lightweight and convenient, controlled by an intuitive directional keyboard, advanced industrial electronics installed under the housing allow for excellent ultrasonic performance and reliable identification of near-surface defects in test pieces.

advantage
The ideal equipment for portable ultrasonic inspection, because of its ease of use, is very suitable for use in confined Spaces.
The USM Go+ is designed with a rugged rubber housing that can withstand extremely harsh field conditions and meets IP67 dust and water standards.
The 108mm x 64, 8mm screen (enlarged mode) has an excellent 800 x 480 pixel resolution, providing best-in-class echo resolution
Whether in bright daylight or in the dark, the display is clearly readable and can be adjusted to your operating environment.
The excellent near-surface resolution allows you to detect defects under the surface of the specimen very reliably

peculiarity
A-Scan video recording up to 8 minutes, the entire inspection process can be reported and played back on-site for more people to see
A true two-handed universal instrument with a flip-over display
AUTOANG (Automatic Angle Measurement) automatically calculates the transverse wave refraction Angle of the inclined probe and uses it to measure the horizontal distance and depth distance of defects
A standard USB connection allows data to be downloaded from the flaw detector for further analysis or storage
The instrument’s 2GB memory can be easily replaced with an SD card of up to 16GB
The generated reports are in jpeg or bmp format, so no special reading software is required
The Bottom Wave attenuator (BEA) helps to detect extremely small defects and improve detection capabilities
Automatic gate thresholds for 2 grids ensure accurate measurements under the same conditions

Apply
Weld inspection
Forgings and castings inspection
Track detection
Composite material testing
More demanding applications such as narrowband filters, low-noise digital amplifiers and square-wave pulse generators